MicroElectroMechanical Systems (MEMS) technology permits the fabrication of complex, mechanical shapes on a  micron scale, using batch processing similar to that used by integrated circuit manufacturers.   A new generation of micro mechanical sensors and actuators is arising, and interfacing to these transducers presents new opportunities and challenges to the circuit engineers and technologist, including:

• capacitive sensors requiring sub-femto Farad resolution and noninvasive stimulation;
• high-Q resonant structures for oscillators and micro-mechanical mixers and filters;
• variable capacitors and suspended inductors for high frequency tuned oscillators;
• suspended resistive bridges for low thermal time constant;
• closed loop, e.g. force-balanced and/or levitated, sensors and actuators;
• large transducer arrays of which demand low-noise, power-efficient circuits;

CAD and process technology for integrated MEMS and circuit chips.

The workshop consisted of approximately eighteen 30-minute talks in these areas spread over 1.5 days, i.e. Thursday and Friday morning following the ISSCC Program Committee meeting for paper selection.  Mid-morning and mid-afternoon coffee breaks, in addition to lunch and reception on Thursday evening, were planned to allow participants to interact.